XHPS Specifications

Package Types
XH1 Series:
XH3 Series:

All SOIC devices 150-mil (narrow body)
All SOIC devices 300-mil (wide body)

Index Time:

1.1 sec (without test time)

System Throughput:

Up to 2500 units per hour, typically without test time

Temperature Range:

-40 °C to +150 °C

Contacting:

One test site Kelvin contact, typically 90 mR (mΩ)

Pitch:

1.27 mm and 0.8 mm available

Input / Output Characteristics

Several Sections Available

Input:

Tube holder for manual loading or automatic tube loader

Handler(s):

One, two or three in cascade depending on users request

Output:

Tube holder for manual unloading or good devices automatic tube unloader. Two output categories.

Jam Rate:

1 jam per 2000 devices typically, but depending on the quality of the package

Physical Characteristics

Dimensions:

Approx. 800(w) x 1500(d) x 1800(h) mm
(for a single handler without tube loader and unloader)

Weight:

Approx. 130 kg for a single handler, without test system

Power Requirements

Electrical:

220 V, 50 Hz, 1.5 kW, 110 V possible

Air:

Dried air at 10 bar max. The handler runs typically at 6 bar

LN₂ Requirements:

7.5 kg/h LN₂ at -40 °C with a max pressure of 1.6 bar

Temperature Characteristics

-40 °C to +150 °C (±3 °C) for a tri-temp
660mm soak length for a 150-mil handler.
960mm soak length for a 300-mil handler.

Machine Interface

RS 232, one character protocol:
R = Retest, F = Fail, G = Good device, sent by test system.
S = Start test, sent by handler.

Logic Control System

A PC, equipped with the XPEQT high-speed serial card controls the handlers’ state machine, error trapping and diagnostics.

Temperature Control System

An intelligent temperature PID control algorithm, controlled by the PC assures the set point. This system is watchdog protected, and uses a weighed function of air and metal temperature to control the temperature in the test and soak chambers.